Product Name : SMD Molding Choke BSF□□□□PIEL Series

Model : BSF□□□□PIEL SERIES


SPECIFICATION OF BSF□□□□PIEL SERIES
 

FEATURE
1. High performance (Isat) realized by metal dust core.
2. Very low profile : Thickness with 1.6 to 5.0 mm.
3. Low loss with low DCR.
4. Capable of corresponding high frequency (3MHz).


APPLICATIONS
DC/DC Converter for CPU in Notebook PC.
Graphic Card , VRM , POL , DSC , Mobile Phone ,
LCD panel , LCD TV , HD.


ORDERING CODE.

(1) PRODUCT TYPE CODE AND SIZE CODE
(2) INDUCTANCE
(3) INDUCTANCE TOLERANCE(M:20%,N:30%)
(4) REEL TAPING


 

 

Appearance and Dimensions (mm)





 

UNIT : mm
SIZE CODE
A
mm
B
mm
C
(max)
D
(mm)
E
(mm)
F
(TYP)
G
(TYP)
H
(TYP)
Fig
Series Spec.
BSF0402PIEL
4.05±0.25
4.45±0.25
2.0
1.5±0.3
0.8±0.3
4.95
2.15
2.30
1
BSF0603PIEL
6.6±0.3
7.1±0.3
3.0
3.0±0.3
1.6±0.5
7.40
3.70
3.50
1
BSF0603TPIEL
6.6±0.3
7.1±0.3
3.0
3.0±0.3
1.6±0.5
7.40
3.70
3.50
1
BSF1004CTPIEL
10.0±0.3
11.5 max
4.0
3.0±0.5
2.5±0.5
13.0
6.00
4.00
1
BSF1004DTPIEL
10.0±0.3
11.5 max
4.0
3.0±0.5
2.5±0.5
13.0
6.00
4.00
1
BSF1235PIEL
12.8±0.5
13.5±1.0
3.5±0.5
3.8REF
2.5REF
15.0
6.00
5.00
1
BSF1250PIEL
12.8±0.5
13.5±1.0
5.0
3.8REF
2.5REF
15.0
6.00
5.00
1
BSF1265PIEL
12.8±0.5
13.5±1.0
6.5
3.8REF
2.5REF
15.0
6.00
5.00
1
BSF1770PIEL
17.15 max
18.0±0.3
7.0
11.94±0.3
2.11±0.3
18.03
11.68
12.09
2

 

 

 

1. Other sizes are available upon request.
2. All the data listed in this catalogue are for reference only, King Core reserves
the right to alter or revise the specifications without prior notification.