Product Name : BSF MOLDING TYPE SERIES

Model : BSF MOLDING SERIES


SPECIFICATION OF BSF MOLDING TYPE SERIES
 

FEATURE
1. High performance (Isat) realized by metal dust core.
2. Low profile : Thickness with 2.0 to 7.0 mm for different size.
3. Capable of corresponding high frequency (1MHz).
4. Capable of corresponding high frequency (3MHz).
5.Halogen free, lead free, RoHS compliant.


APPLICATIONS
DC/DC Converter for CPU in Notebook PC.
Thin type on-board power supply module for exchanger. VRM for server.
Graphic Card , DSC , Mobile Phone , LCD panel , LCD TV , HDD.


ORDERING CODE.

(1) PRODUCT TYPE CODE AND SIZE CODE
(2) INDUCTANCE
(3) INDUCTANCE TOLERANCE(M:20%,N:30%)
(4) REEL TAPING


 

 

SHAPE & DIMENSIONS Unit:(mm)







UNIT : mm
SIZE CODE
A
mm
B
mm
C
(max)
D
(mm)
E
(mm)
F
(TYP)
G
(TYP)
H
(TYP)
Fig
Series Spec.
BSF2010MPXU
2.0±0.2
1.6±0.2
1.0
0.5±0.2
---
2.3
0.9
1.6
1
BSF2510MPXU
2.5±0.2
2.0±0.2
1.0
0.6±0.2
---
2.8
1.2
2.0
1
BSF2512MPXU
2.5±0.2
2.0±0.2
1.2
0.6±0.2
---
2.8
1.2
2.0
1
BSF0402PIEL
4.05±0.25
4.45±0.25
2.0
1.5±0.3
0.8±0.3
4.95
2.15
2.30
2
BSF0603PIEL
6.6±0.3
7.1±0.3
3.0
3.0±0.3
1.6±0.5
7.40
3.70
3.50
2
BSF0603TPIEL
6.6±0.3
7.1±0.3
3.0
3.0±0.3
1.6±0.5
7.40
3.70
3.50
2
BSF1034PCEL
10.0±0.3
11.5max
3.4
2.8±0.5
2.0±0.5
13.0
6.0
6.0
2
BSF1004xPCEL
10.0±0.3
11.5 max
4.0
2.8±0.5
2.0±0.5
13.0
6.00
4.00
2
BSF1005PCEL
10.0±0.3
11.5 max
5.0
2.8±0.5
2.0±0.5
13.0
6.00
4.00
2
BSF1235PIEL
12.8±0.5
13.5±1.0
3.5±0.5
3.8REF
2.5REF
15.0
6.00
5.00
2
BSF1250PIEL
12.8±0.5
13.5±1.0
5.0
3.8REF
2.5REF
15.0
6.00
5.00
2
BSF1265PIEL
12.8±0.5
13.5±1.0
6.5
3.8REF
2.5REF
15.0
6.00
5.00
2
BSF1770PIEL
17.15 max
18.0±0.3
7.0
11.94±0.3
2.11±0.3
18.03
11.68
12.09
3

 

 

 

1. Other sizes are available upon request.
2. All the data listed in this catalogue are for reference only, King Core reserves
the right to alter or revise the specifications without prior notification.